常化温度对高牌号无取向硅钢析出物的影响

电工钢 ›› 2020, Vol. 2 ›› Issue (3): 18-24.

常化温度对高牌号无取向硅钢析出物的影响

刘文鹏1，高振宇1，郭琪2，辛亚会3，陈春梅1，李亚东1

1.鞍钢集团有限公司钢铁研究院，辽宁鞍山 114009；2 鞍钢股份有限公司冷轧硅钢厂, 辽宁鞍山 114009；3.东北大学轧制技术及连轧自动化国家重点实验室，辽宁沈阳 110000

出版日期:2020-08-28 发布日期:2020-09-08

Effects of normalizing temperatures on precipitates of high grade non oriented silicon steel

LIU Wenpeng1，GAO Zhenyu1，GUO Qi2，XIN Yahui3，CHEN Chunmei1，LI Yadong1

1. Iron and Steel Research Institutes of AnSteel Group Corporation, Anshan 114009, China; 2. Cold Rolling Silicon Steel Plant of Anshan Iron & steel Co. Ltd., Anshan 114009, China; 3. State Key Laboratory of Rolling and Automation of NEU, Shenyang 110000, China

Online:2020-08-28 Published:2020-09-08

摘要/Abstract

摘要： 对硅的质量分数为3.2 %的高牌号无取向硅钢进行了不同温度的常化处理，之后采用相同工艺的冷轧和退火，然后对钢中析出物进行观测。结果表明：随着常化温度的提高，常化板中析出物尺寸逐渐增大，面密度逐渐减小；成品板析出物面密度整体上呈先下降后上升的趋势。同时，当常化温度在850~950 ℃时，成品板中析出物数量在50~100 nm的尺寸范围内所占比重达到最大。

关键词: 无取向硅钢, 常化温度, 析出物, 磁性能

Abstract: The high grade non oriented silicon steel samples of 3.2 % Si were firstly normalized at different temperatures, and then rolled and annealed in the same way, and at last the precipitates in the steel samples were observed in this paper. The results of the precipitate observation showed that the precipitate size in normalized plates was gradually increased and the areal density of the precipitate gradually decreased as the normalizing temperatures increased, while in final annealed plates the areal density of the precipitate was firstly decreased and then increased. And meanwhile, it can be found that the amounts of the precipitaes with the size from 50 to 100 nm were maximized when the normalizing temperature was set between 850 ℃ and 950 ℃.

Key words: non oriented silicon steel, normalizing temperature, precipitate, magnetic property

刘文鹏, 高振宇, 郭琪, 辛亚会, 陈春梅, 李亚东. 常化温度对高牌号无取向硅钢析出物的影响[J]. 电工钢, 2020, 2(3): 18-24.

LIU Wenpeng, GAO Zhenyu, GUO Qi, XIN Yahui, CHEN Chunmei, LI Yadong. Effects of normalizing temperatures on precipitates of high grade non oriented silicon steel[J]. Electrical Steel, 2020, 2(3): 18-24.

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